Process Hierarchy

on front
  Tungsten DC-magnetron sputtering
Materialtungsten
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0 .. 0.4 µm
0 .. 0.4 µm
Batch sizes 100 mm: 9, 150 mm: 2
Material tungsten
Wafer size
Wafer size