Process Hierarchy

on front
  Photoresist coat (Shipley 220)
on front
  2 100% HMDS prime
MaterialHMDS
MaterialShipley 220Thickness7 µm
  4 Soft bake
Material Shipley 220
Resist thickness 7 µm
Wafer size
Wafer size
Comments:
  • The film is softbaked at 90 C for 25 min.