Process Hierarchy

on front
  Spin casting Programmable Spinner
Process characteristics:
Thickness of film to be deposited.
Thickness of film to be deposited., must be 1.4 .. 10 µm
1.4 .. 10 µm
Batch size 1
Sides processed either
Equipment Headway Programmable Photoresist Spinner
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
1 .. 6 inch
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 800 µm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, glass (category), other, silicon