on front Photoresist coat (AZ P4400) |
|
| Process characteristics: |
| Thickness |
|
|---|
| Material |
AZ P4400 |
|---|
| Min feature size |
1 µm |
|---|
| Sides processed |
either |
|---|
| Temperature |
25 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Headway spinner |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1, 200 mm: 1, 75 mm: 1 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
