Process Hierarchy

  Resist UV Stabilization
Ambient to which substrate is exposed during processing
Material AZ 5214e
Temperature 230 °C
Thickness 0.5 .. 2 µm
Wafer size
Wafer size
Equipment Fusion Photoresist UV Stabilizer
Equipment characteristics:
Batch sizes 100 mm: 25, 150 mm: 25, 75 mm: 25
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, quartz (fused silica), silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
250 .. 800 µm