on front HMDS prime (manual) |
|
| Batch size |
1 |
|---|
| Material |
HMDS |
|---|
| Pressure Pressure of process chamber during processing |
1 atm |
|---|
| Sides processed |
either |
|---|
| Temperature |
25 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Solitec 5100 |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
|---|
| Comments: |
|
