on front Gold E-beam Evaporation |
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| Process characteristics: |
| Thickness |
|
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| Material |
gold |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
CHA e-Beam Vacuum Evaporator System |
| Equipment characteristics: |
| Batch sizes |
100 mm: 8, 150 mm: 5, 75 mm: 8 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer holder Device that holds the wafers during processing. |
mechanical clamp |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
quartz (fused silica), sapphire, gallium arsenide, silicon, silicon on insulator |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
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