Thermocompression Bonding |
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| Process characteristics: |
| Bonding Ambient |
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| Wafer size |
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| Equipment |
Karl Suss SB6 |
| Equipment characteristics: |
| Batch sizes |
100 mm: 2, 150 mm: 2 |
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| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
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| Wafer holder Device that holds the wafers during processing. |
metal chuck |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, Corning 1737 |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
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