Karl Suss SB6

Model SB6
Type commercial
Equipment Characteristics
Batch sizes 100 mm: 2, 150 mm: 2
MOS clean no
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 .. 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, Corning 1737
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm