Furnace anneal (Nitrogen) |
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| Process characteristics: |
| Process duration |
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| Temperature |
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| Anneal ambient |
nitrogen |
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| Wafer size |
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| Equipment |
FNA1 |
| Equipment characteristics: |
| Batch sizes |
150 mm: 25 |
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| MOS clean |
yes |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 675 µm |
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