Process Hierarchy

  Linewidth metrology
Line width 1 .. 40 µm
Magnifications 5, 10, 20, 50, 100
Materials photoresist on silicon nitride, silicon dioxide, silicon nitride on silicon, photoresist on silicon dioxide, photoresist on silicon, silicon nitride on silicon dioxide
Wafer size
Wafer size
Equipment Nikon L-200 microscope
Equipment characteristics:
Batch sizes 100 .. 200 mm: 1
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
2 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
triangular shard, other, rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
300 .. 675 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, fused silica, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 675 µm