Nikon L-200 microscope |
|
|---|---|
| Model | L-200 |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 .. 200 mm: 1 |
| MOS clean | no |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
2 .. 150 mm |
| Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, other, rectangular, irregular, circular |
| Piece thickness Range of wafer piece thickness the equipment can accept |
300 .. 675 µm |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 .. 200 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, fused silica, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 675 µm |