Process Hierarchy

  Oven anneal
Process characteristics:
Process duration
Process duration*
must be 5 .. 240 min
5 .. 240 min
must be 20 .. 280 °C
20 .. 280 °C
Anneal ambient air
Batch size 3
Wafer size
Wafer size
Equipment Blue M Bake Oven
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
stainless steel
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm