Process Hierarchy

on front
  G-line BCB develop (BCB4000)
Batch size 10
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
Duration 90 s
Sides processed either
Wafer size
Wafer size
Equipment MTI BCB coater
Equipment characteristics:
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
plastic chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, sapphire, quartz (single crystal), silicon germanium, Foturan (Schott), quartz (fused silica), fused silica, ceramic, glass-ceramic, silicon on insulator, alumina, glass (Hoya), silicon on sapphire, Corning 1737, Borofloat (Schott), Pyrex (Corning 7740), silicon carbide
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1100 µm