Process Hierarchy

  Edge bead removal
Depth 1.4 .. 10 µm
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
AZ 312/water [1:1]
Etch type wet isotropic
Material AZ 5214e
Temperature 20 °C
Wafer size
Wafer size
Equipment Suss ACS200 Wafer Coater / Developer
Equipment characteristics:
Batch sizes 100 mm: 25, 150 mm: 25, 75 mm: 25
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
274 .. 700 µm