Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact photolithography (Image reversal)
  1 HMDS Prime
MaterialHMDS
on front
  2 Photoresist coat (AZ P4400)
MaterialAZ P4400
  3 Photoresist softbake
Materialphotoresist (category)
on front
  4 Contact front-to-front Align & Expose
  5 Image reverse
on front
  6 Flood Expose
  7 Photoresist develop (AZ P4400)
MaterialAZ P4400
on front
  8 Photoresist descum
Materialphotoresist (category)
Process characteristics:
Alignment side
Alignment side*
Perform descum
To clean the photoresist residue in open areas
Perform descum*
yes no
To clean the photoresist residue in open areas
Perform hard bake
Please select "no" if this module will be used for a lift-off operation.
Perform hard bake*
yes no
Please select "no" if this module will be used for a lift-off operation.
Resist thickness
Resist thickness*
Batch size 1
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 equal line space
Field geometry
Shape of field with dimensions characterized by the maximum field size
 circle
Magnification 1
Materials AZ 4620, AZ P4400
Max field size 150 mm
Min feature size 1 .. 5 µm
Photoresist polarity positive
Wafer size
Wafer size
Comments:
Attachments
[Thumbnail]4620-15s-b.jpg (108.5 KB, image/jpeg)
attached by mpedersen (Michael Pedersen) on 2004-03-29 09:32
Resist wall profile with AZ 4620.
[Thumbnail]4400-15s-c.jpg (119.2 KB, image/jpeg)
attached by mpedersen (Michael Pedersen) on 2004-03-29 09:31
Resit wall profile with AZ P4400.