Process Hierarchy

on front
  G-line photoresist hardbake (AZ4000)
Duration 20 min
Materials AZ 4330, AZ 4620
Sides processed either
Temperature 125 °C
Wafer size
Wafer size
Equipment Fisher oven
Equipment characteristics:
Batch sizes 100 mm: 25, 125 mm: 25, 150 mm: 25
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Borofloat (Schott), ceramic, Corning 1737, Foturan (Schott), Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm