Process Hierarchy

on front
  Metal lift-off
MaterialShipley 1827Resist thickness2.7 µm
  1.1 Prebake
on front
  1.2 HMDS coat
MaterialHMDS
MaterialShipley 1827Thickness2.7 µm
on front
  1.6 Optical Exposure
MaterialShipley 1827
Materialphotoresist (category)
on front
  3 E-beam Evaporation (Cr)
Materialchromium
on front
  4 E-beam Evaporation (Au)
Materialgold
MaterialShipley 1827
Depth100 µm
Process characteristics:
Adhesion layer material
Adhesion layer material*
Adhesion layer thickness
Adhesion layer thickness*
must be 30 .. 50 nm
30 .. 50 nm
Alignment side
Alignment side*
Material
Material*
Thickness
Thickness*
must be 100 .. 2000 Å
100 .. 2000 Å
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
line
Field geometry
Shape of field with dimensions characterized by the maximum field size
circle
Magnification 1
Max field size 100 mm
Min feature size 5 µm
Resist thickness 2.7 µm
Wafer size
Wafer size
Comments: