Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Resist bonding (Shipley 1827)
  1 Dehydration bake
on front
  2 HMDS prime (manual)
MaterialHMDS
on front
  3 Photoresist coat (spoke pattern Shipley 1827)
MaterialShipley 1827Thickness2.7 µm
  4 Resist bond
  5 Photoresist hardbake (110 degC)
Material Shipley 1827
Resist thickness 2.7 µm
Wafer size
Wafer size