Process Hierarchy

  Resist bond
Batch size 1
Wafer size
Wafer size
Equipment Silicon organic wet bench
Equipment characteristics:
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
50 .. 1000 µm
  • Wafers brought into contact, no alignment.