Process Hierarchy

on front
  Resist hardening
Batch size 4
Pressure of process chamber during processing
760 Torr
Process duration 75 min
Sides processed either
Temperature 110 °C
Wafer size
Wafer size
Equipment UV Harden
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon germanium, silicon on insulator, quartz (single crystal)
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 700 µm
  • Photoresist hardening must be performed before etching in AMT 8100 to avoid resist burning.