Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  ESEM analysis
Process characteristics:
Materials
Material(s) to inspect.
Materials
Available  
Selected
Material(s) to inspect.
Excluded materials gold (category), copper
Magnification 20 .. 300000
Pressure
Pressure of process chamber during processing
 1e-07 .. 10 Torr
Sides inspected
The sides of the wafer inspected by the process
 either
Temperature -20 .. 1500 °C
Wafer size
Wafer size
Equipment Philips XL-30 ESEM
  • The Philips XL-30 ESEM is a flexible scanning electron microscope with a large chamber. It can be used for conventional high vacuum imaging, or in the environmental mode, can be used to examine wet, oily, gassy or non-conducting samples. Samples can be examined in an atmosphere of up to 10 torr of water vapour, oxygen, nitrogen carbon dioxide or any other non-corrosice gas.
Equipment characteristics:
Batch sizes 100 mm: 1, 75 mm: 1
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
 5 .. 100 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
 circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
 0 .. 1 cm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
 aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator, silicon on sapphire, titanium
Wafer thickness
List or range of wafer thicknesses the tool can accept
 0 .. 1 cm
Comments:
  • the accessories available include an EBSP camera for crystallographic orientation imaging, a deformation stage capable of 1000lbs force.
  • An attached Noran X-ray system permits qualitative and quantitative EDX spectroscopy, X-ray mapping, and line scans.
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.