|
| Pressure Pressure of process chamber during processing |
1 atm |
|---|
| Sides processed |
both |
|---|
| Temperature |
1000 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Thermco TMX furnace (B-stack) |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
quartz boat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 530 µm |
|---|
| Comments: |
|
