|
| Material |
Shipley UV210 |
|---|
| Setup time |
30 min |
|---|
| Sides processed |
both |
|---|
| Temperature |
130 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
SVG 8800 Photoresist coat and develop track |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 800 µm |
|---|
