Process Hierarchy

  Anodic bonding (air, with alignment)
Alignment type
Method used to align materials to be bonded.
Ambient to which substrate is exposed during processing
Pressure of process chamber during processing
1 atm
Wafer size
Wafer size
Equipment EVG 501 Bonder
  • No organic material allowed in this equipment.
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 3000 µm
  • Total thickness < 3mm.
    No organic material allowed in the bonder.