EVG 501 Bonder

Model 501
Type commercial
  • No organic material allowed in this equipment.
Equipment Characteristics
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 3000 µm