Process Hierarchy

on front
  Stylus profilometer step measurement
Batch size 1
Depth 0.1 .. 65.5 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Field geometry
Shape of field with dimensions characterized by the maximum field size
Max field size 5 mm
Sides processed either
Wafer size
Wafer size
Equipment Dektak 6M
  • Stylus: Diamond, 1.25um radius
    Max sample thickness: 31.75mm
    vertical range: 50A-2620kA
    Scan length: 50 microns -30 millimeter
    Max. data points per scan: 30,000 with a max resolution of 0.067um for a 2000um scan length
Equipment characteristics:
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
1 .. 100 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
other, rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
300 .. 1500 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, silicon on insulator, quartz (fused silica), indium phosphide, silicon, Pyrex (Corning 7740), gallium arsenide
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 5000 µm
  • Measurement profile datafiles can be provided to customer, but must be explicitly requested in advance. Extra charges apply when providing datafiles, at a rate of $5 per file (1 file per measurement).
  • Pricing assumes up to 5 measurements per wafer. Additional measurements will require additional pricing.
  • Please specify desired measurement locations.