Dektak 6M
Model
Type commercial
Comments
  • Stylus: Diamond, 1.25um radius
    Max sample thickness: 31.75mm
    vertical range: 50A-2620kA
    Scan length: 50 microns -30 millimeter
    Max. data points per scan: 30,000 with a max resolution of 0.067um for a 2000um scan length
Equipment Characteristics
Batch sizes 25 .. 150 mm: 1
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
 1 .. 100 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
 other, rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
 300 .. 1500 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 25 mm, 50 mm, 75 mm, 100 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
 aluminum plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 alumina, silicon on insulator, quartz (fused silica), indium phosphide, silicon, Pyrex (Corning 7740), gallium arsenide
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 5000 µm