Nitrogen anneal: View
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
or call us at (703) 262-5368
Running time of the process (excluding setup/shutdown time)
Running time of the process (excluding setup/shutdown time), must be 0 .. 1440 min
0 .. 1440 min
Maximum temperature the substrate reaches during a process
Maximum temperature the substrate reaches during a process, must be 400 .. 1100 °C
400 .. 1100 °C
Ambient to which substrate is exposed during processing
75 .. 100 mm
Tylan Furnace (N2 anneal, Tubes #1 .. #4, #7)
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat
Device that holds the wafers during processing.
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator
List or range of wafer thicknesses the tool can accept
300 .. 600 µm
The equipment time consists of "the anneal time" plus the "ramp up & ramp down times" plus "the boat in and out times".
How to Start