Process Hierarchy

Batch size 1
Wafer diameter(s)
List or range of wafer diameters the tool can accept
10 .. 200 mm
Wafer size
Wafer size
Equipment Disco Die Saw
Equipment characteristics:
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Borofloat (Schott), fused silica, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
50 .. 1000 µm