Process Hierarchy

  Locker release (LC)
Process characteristics:
Substrate diameter
List or range of wafer diameters the tool can accept
Substrate diameter*
List or range of wafer diameters the tool can accept
Allowed materials chromium, gold, silicon dioxide, photoresist (category), platinum
Batch size 1
Piece dimension
Range of wafer piece dimensions the equipment can accept
5 .. 100 mm
Substrate material silicon
Comments:
  • Minimum order amount corresponds to 2 items (wafers or pieces).