Process Hierarchy

  BOE Etch
Process characteristics:
must be 0.01 .. 10 µm
0.01 .. 10 µm
Etch type wet isotropic
Material silicon dioxide
Wafer size
Wafer size
Equipment Acid Wet Deck
Equipment characteristics:
Batch sizes 100 mm: 25, 150 mm: 25, 75 mm: 25
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
teflon boat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm