Process Hierarchy

on front
  Stylus profilometer step measurement
Contact force
Force applied at contact point
5 mN
Depth 0 .. 1000 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Max field size 20 mm
Sides processed either
Wafer size
Wafer size
Equipment Veeco Dektak 200SL
Equipment characteristics:
Batch sizes 10 .. 150 mm: 1
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
10 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
triangular shard, other, rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
100 .. 3000 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
ceramic, gallium arsenide, Foturan (Schott), Pyrex (Corning 7740), Corning 1737, silicon on insulator, alumina, silicon, polycarbonate, sapphire, fused silica
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 3000 µm