Process Hierarchy

  Plasma Bond Activation and Non-Aligned Prebonding
Ambient to which substrate is exposed during processing
trifluoromethane, oxygen, carbon tetrafluoride
Batch sizes 100 mm: 2
Wafer size
Wafer size
Equipment Plasmalab MicroEtch
Equipment characteristics:
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon carbide, silicon, gallium arsenide
Wafer thickness
List or range of wafer thicknesses the tool can accept
0 .. 1000 µm