Process Hierarchy

  Wafer Bond Pre-Align
Wafer size
Wafer size
Equipment Karl Suss BA6
Equipment characteristics:
Batch sizes 100 mm: 2, 150 mm: 2
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
stainless steel
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, Pyrex (Corning 7740)