Process Hierarchy

  Spectrophotometric film thickness measurement
Process characteristics:
Film thickness 5 .. 5000 nm
Wafer size
Wafer size
Equipment Nanometrics NanoSpec
Equipment characteristics:
Batch sizes 100 .. 150 mm: 1
MOS clean yes
Piece dimension
Range of wafer piece dimensions the equipment can accept
2 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
triangular shard, other, rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
300 .. 2000 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator, fused silica
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 900 µm