Process Hierarchy

on front
  SEM analysis
Process characteristics:
Duration os SEM inspection
Duration os SEM inspection, must be 1 .. 100 hour
1 .. 100 hour
Batch size 1
Magnifications 100 .. 500000
Sides inspected
The sides of the wafer inspected by the process
Wafer size
Wafer size
Equipment Hitachi 4700 FE
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
2 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
triangular shard, other, rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 2000 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 2000 µm