Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Solder bonding (vacuum, with alignment)
on front
  1 Solder deposition
  2 Solder bonding
Process characteristics:
Alignment type
Method used to align materials to be bonded.
Alignment type*
Method used to align materials to be bonded.
Batch size 2
Bonded materials
Pair of materials bonded by this process
 gold
Pressure
Pressure of process chamber during processing
 0.1 mTorr