Process Hierarchy

on front
  Stylus profilometer 1-D step measurement
Contact force
Force applied at contact point
5 mN
Depth 0 .. 1000 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Max field size 20 mm
Sides processed either
Wafer size
Wafer size
Equipment Dektak surface profilometer
Equipment characteristics:
Batch sizes 2 .. 150 mm: 1
Die area
Die area the equipment can accept
5 .. 10000 cm2
Die holder
Device that holds the die(s) during processing
metal chuck
Die materials
List of allowed materials for dies accepted by this equipment
Die thickness
List or range of die thicknesses the tool can accept
150 mm
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
300 .. 2000 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
triangular shard, other, rectangular, irregular, circular
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, quartz (fused silica), silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 2000 µm
Extra terms