Process Hierarchy

  Spin-Rinse-Dry (SemiTool)
Wafer size
Wafer size
Equipment SemiTool SRD
Equipment characteristics:
Batch sizes 100 mm: 25, 75 mm: 25
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
250 .. 800 µm