Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Photoresist ashing (non-clean -March)
Batch size 1
Material photoresist (category)
Selectivity
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
 photoresist (category): 1
Sides processed either
Temperature 25 °C
Wafer size
Wafer size
Equipment March asher
  • This is a gold contaminated tool.
Equipment characteristics:
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, silicon carbide, gallium arsenide, Borofloat (Schott), silicon on insulator, quartz (fused silica), Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1000 µm