Process Hierarchy

  Pocket wafer
Batch sizes 150 mm: 1
Depth 300 .. 350 mm
Diameter 100 mm
Wafer size
Wafer size
Equipment STS DRIE
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
electrostatic chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 750 µm
  • 100mm wafer holder in 150mm wafers.
  • ~100mm diameter area etched ~300um deep to form pocket in ~700 microns thick
    150mm diameter wafer.