|
| Cleaning agents |
1-Methyl-2-Pyrrolidinone |
|---|
| Sides processed |
both |
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| Temperature |
80 °C |
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| Wafer size |
|
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| Equipment |
Wet Bench |
| Equipment characteristics: |
| Batch sizes |
25 .. 200 mm: 1 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 3000 µm |
|---|
