Process Hierarchy

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  Optical Microscopy
Process characteristics:
Duration of microscope inspection
Duration of microscope inspection, must be 0.25 .. 100 hour
0.25 .. 100 hour
Batch size 1
Sides inspected
The sides of the wafer inspected by the process
Wafer size
Wafer size
Equipment Nikon Fluorescent Microscope
Equipment characteristics:
Die materials
List of allowed materials for dies accepted by this equipment
Alloy 42, alumina, aluminum, aluminum/copper [99.5:0.5], aluminum/silicon [98:2], aluminum/silicon [99:1], aluminum/silicon/copper [98:1:1], Beryllium Copper, BK7, Borofloat (Schott), borophosphosilicate glass, BPSG, brass, chromium, chromium (transparent), chromium/aluminum, chromium/gold, chromium/gold/chromium, copper, Corning 1737, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass (spin-on), gold, gold (nano-porous), gold/titanium, indium phosphide, indium tin oxide, Kovar, lead, molybdenum, Nichrome, nickel, palladium, permalloy, phosphosilicate glass, phosphosilicate glass (low temperature), plating base metal, platinum, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon (doped), silicon (single crystal), silicon dioxide, silicon dioxide (low temperature), silicon germanium, silicon on insulator, silicon on sapphire, silver, soda lime, stainless steel, tantalum, titanium, titanium/aluminum, titanium/nickel, titanium/tungsten, tungsten, vanadium, white crown
MOS clean yes
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
100 .. 5000 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
glass plate
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 5000 µm