Process Hierarchy

on front
  Bottom anti-reflection coating (BARC) etch
Depth 700 Å
Material BARC
Sides processed either
Temperature 23 °C
Wafer size
Wafer size
Equipment Lam 4
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
Wafer holder
Device that holds the wafers during processing.
helium clamp
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 2000 µm