on front Bottom anti-reflection coating (BARC) etch |
|
| Depth |
700 Å |
|---|
| Material |
BARC |
|---|
| Sides processed |
either |
|---|
| Temperature |
23 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Lam 4 |
| Equipment characteristics: |
| Wafer geometry Types of wafers this equipment can accept |
1-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
helium clamp |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 2000 µm |
|---|
