Process Hierarchy

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  AFM (Atomic force microscopy)
Process characteristics:
Material(s) to inspect.
Material(s) to inspect.
Measurements per wafer
Measurements per wafer*
must be 1 .. 20
1 .. 20
Sides inspected
The sides of the wafer inspected by the process
Wafer size
Wafer size
Equipment Digital instruments AFM
  • Sample should be un-patterned.
Equipment characteristics:
Batch sizes 100 mm: 1, 125 mm: 1, 150 mm: 1, 200 mm: 1, 50 mm: 1, 75 mm: 1
Piece dimension
Range of wafer piece dimensions the equipment can accept
10 .. 200 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 1000 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
  • All data will be included in the runcard -in MS Excel format or in TIFF format for images- once it has become available.