on front Stylus profilometer step measurement |
|
| Contact force Force applied at contact point |
0.01 .. 0.4 mN |
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| Depth |
100 µm |
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| Measurement unit |
angstrom, micron |
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
Tencor Alpha Surface profilometer |
| Equipment characteristics: |
| Batch sizes |
50 .. 150 mm: 1 |
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| MOS clean |
no |
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| Piece dimension Range of wafer piece dimensions the equipment can accept |
2 .. 150 mm |
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| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 1000 µm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, Borofloat (Schott), ceramic, Corning 1737, Foturan (Schott), gallium arsenide, Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
