Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Glass frit bonding
  1 Glass frit printing/firing
  2 Glass frit bonding (vacuum)
Process characteristics:
Alignment type
Method used to align materials to be bonded.
Alignment type*
Method used to align materials to be bonded.
Second substrate side bonded
Second substrate side bonded*
Substrate side bonded
Substrate side bonded
Alignment tolerance
Registration of CAD data to features on wafer
 10 µm
Batch size 2
Second substrate diameter 50 mm
Second substrate material Pyrex (Corning 7740)
Second substrate thickness 300 .. 1000 µm
Temperature 400 °C
Wafer size
Wafer size