on front I-line flood exposure (MA6) |
|
| Material |
photoresist (category) |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Karl Suss MA6 mask aligner |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1, 75 mm: 1 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), glass (Hoya), Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |
|---|
